Abstract:
This paper is focused on designing and optimization of a Micro Electro Mechanical System (MEMS)
based piezoresistive .t ype pressure 10 enhance the sensitivity by optimally utilizing the maximum
available Silicon wafer cell volume of 3mmX3mmX400pm and a fixed thickness of 10pm due to fabrication
constrains. Here an analysis is carried out by varying the dimensions of two different diaphragm geometries,
namely conventional square type diaphragm and cross-sectional beam type diaphragm. The analysis is done
using finite element method (FEM) technique in ANSYS software and by comparing the results, the better
diaphr agm type is chosen for the required pressure range oj the application for flash fiood level
The results show that for some pressure ranges the cross-sectional beam type diaphragm delivers a much
better sensitivity than the conventional square type diaphragm.
