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Enhancing the thermal performance of epoxy adhesive used in the cfrp/concrete bond

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dc.contributor.author Widanage, C
dc.contributor.author Gamage, JCPH
dc.contributor.author Attanayake, V
dc.contributor.editor Adhikariwatte, W
dc.contributor.editor Rathnayake, M
dc.contributor.editor Hemachandra, K
dc.date.accessioned 2022-10-20T10:01:20Z
dc.date.available 2022-10-20T10:01:20Z
dc.date.issued 2021-07
dc.identifier.citation C. Widanage, J. C. P. H. Gamage and V. Attanayake, "Enhancing the Thermal Performance of Epoxy Adhesive used in the CFRP/Concrete Bond," 2021 Moratuwa Engineering Research Conference (MERCon), 2021, pp. 281-285, doi: 10.1109/MERCon52712.2021.9525677. en_US
dc.identifier.uri http://dl.lib.uom.lk/handle/123/19182
dc.description.abstract Epoxy adhesive used as the bonding agent in the Carbon Fibre Reinforced Polymer/concrete bond shows poor thermal performance. Therefore, this experimental study focused on modifying the epoxy adhesive by blending recycled Polyethylene terephthalate (PET) fibres to enhance thermal performance. The single-lap shear test was conducted by varying the fibre content in the epoxy adhesive to determine the optimum PET fibre to develop the modified epoxy adhesive. The optimum PET fibre content was selected as 30% of the volume of epoxy. The modified adhesive showed a successful bond strength enhancement in both ambient and elevated temperature conditions when compared to the pure epoxy adhesive. The mechanical properties were tested for the developed epoxy-based adhesive. The modified epoxy adhesive achieved an average bond strength of 827.31 MPa (at 30 °C) for 150 mm bond length. Although the glass transition temperature of pure epoxy was between 60 °C and 80 °C, it was between 120°C and 150 °C for the modified epoxy adhesive. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.relation.uri https://ieeexplore.ieee.org/document/9525677 en_US
dc.subject CFRP en_US
dc.subject Modified epoxy adhesive en_US
dc.subject PET fibres en_US
dc.subject Glass transition temperature en_US
dc.title Enhancing the thermal performance of epoxy adhesive used in the cfrp/concrete bond en_US
dc.type Conference-Full-text en_US
dc.identifier.faculty Engineering en_US
dc.identifier.department Engineering Research Unit, University of Moratuwa en_US
dc.identifier.year 2021 en_US
dc.identifier.conference Moratuwa Engineering Research Conference 2021 en_US
dc.identifier.place Moratuwa, Sri Lanka en_US
dc.identifier.pgnos pp. 281-285 en_US
dc.identifier.proceeding Proceedings of Moratuwa Engineering Research Conference 2021 en_US
dc.identifier.doi 10.1109/MERCon52712.2021.9525677 en_US


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